HS Thermal Pad
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The HS series thermal pads have a silcone and ceramic filled construction. These pads are die-cut to ensure exact fit and reduce module-to-module variation during assembly.
Thermal Pad Features
- Excellent Relative Thermal Index (RTI)
- Electrically Insulating
- High Conformability
- Low Durometer
- Naturally Tacky
